Thermaltake TG-30 heat sink compound Thermal paste 4.5 W/m·K

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.High Thermal ConductivityThe thermal compound contains diamond powder. which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.Easy to ApplyThermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil. which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.All-In-One Application KitThis thermal compound application kit includes a set of easily-applied tools for immediate use.Sustainability and SafetyThe high-quality thermal compound provides [Read more...] a longer lifespan of eliminating dry-out or cracking while in use.Non-electrical conductive compound ensures better safety measures for you and your system.

Thermaltake841163075845

Best Price: £28.31 from PcNova.co.uk

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